SRF2021 - List of Keywords (embedded)

Paper	Title	Other Keywords	Page
MOPFDV001	Investigation of an Alternative Path for SRF Cavity Fabrication and Surface Processing	SRF, cavity, niobium, laser	319
	O. Hryhorenko, D. Longuevergne Université Paris-Saclay, CNRS/IN2P3, IJCLab, Orsay, France C.Z. Antoine CEA-IRFU, Gif-sur-Yvette, France F. Brisset ICMMO, Orsay, France T. Dohmae KEK, Ibaraki, Japan
	The preparation of SRF cavities includes a lengthy, costly, and safety issued electrochemical polishing (EP or BCP) step to remove the damaged layer coming from the cavity fabrication. We have shown that most of the damage layer is originated from the rolling process during the preparation of the sheet material, while subsequent deep drawing tends to leave only µm thick damage layer. We propose a 2-steps mechanical process that allows us to easily get rid of the thick damage layer on the sheets before cavity forming. The process has been established on samples and extended to large disks ready for 1.3 GHz half-cell forming. The polished sheets will be then sent to KEK for half-cell forming and subsequent surface and material analysis before proceeding to half-cell welding. Former studies on the sample demonstrated that damages induced by forming can successfully be removed by recrystallization and less than 10 µm final chemistry.
	Poster MOPFDV001 [2.309 MB]
DOI •	reference for this paper ※ doi:10.18429/JACoW-SRF2021-MOPFDV001
About •	Received ※ 25 June 2021 — Revised ※ 11 July 2021 — Accepted ※ 21 August 2021 — Issue date ※ 15 May 2022
Cite •	reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)

Paper

Title

Other Keywords

Page

MOPFDV001

Investigation of an Alternative Path for SRF Cavity Fabrication and Surface Processing

SRF, cavity, niobium, laser

319

O. Hryhorenko, D. Longuevergne
Université Paris-Saclay, CNRS/IN2P3, IJCLab, Orsay, France
C.Z. Antoine
CEA-IRFU, Gif-sur-Yvette, France
F. Brisset
ICMMO, Orsay, France
T. Dohmae
KEK, Ibaraki, Japan

The preparation of SRF cavities includes a lengthy, costly, and safety issued electrochemical polishing (EP or BCP) step to remove the damaged layer coming from the cavity fabrication. We have shown that most of the damage layer is originated from the rolling process during the preparation of the sheet material, while subsequent deep drawing tends to leave only µm thick damage layer. We propose a 2-steps mechanical process that allows us to easily get rid of the thick damage layer on the sheets before cavity forming. The process has been established on samples and extended to large disks ready for 1.3 GHz half-cell forming. The polished sheets will be then sent to KEK for half-cell forming and subsequent surface and material analysis before proceeding to half-cell welding. Former studies on the sample demonstrated that damages induced by forming can successfully be removed by recrystallization and less than 10 µm final chemistry.

Poster MOPFDV001 [2.309 MB]

DOI •

reference for this paper ※ doi:10.18429/JACoW-SRF2021-MOPFDV001

About •

Received ※ 25 June 2021 — Revised ※ 11 July 2021 — Accepted ※ 21 August 2021 — Issue date ※ 15 May 2022

Cite •

reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)