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RIS citation export for MOPFDV001: Investigation of an Alternative Path for SRF Cavity Fabrication and Surface Processing

TY  - CONF
AU  - Hryhorenko, O.
AU  - Antoine, C.Z.
AU  - Brisset, F.
AU  - Dohmae, T.
AU  - Longuevergne, D.
ED  - Saito, Kenji
ED  - Xu, Ting
ED  - Sakamoto, Naruhiko
ED  - Lesage, Ana
ED  - Schaa, Volker R.W.
TI  - Investigation of an Alternative Path for SRF Cavity Fabrication and Surface Processing
J2  - Proc. of SRF2021, East Lansing, MI, USA, 28 June-02 July 2021
CY  - East Lansing, MI, USA
T2  - International Conference on RF Superconductivity
T3  - 20
LA  - english
AB  - The preparation of SRF cavities includes a lengthy, costly, and safety issued electrochemical polishing (EP or BCP) step to remove the damaged layer coming from the cavity fabrication. We have shown that most of the damage layer is originated from the rolling process during the preparation of the sheet material, while subsequent deep drawing tends to leave only µm thick damage layer. We propose a 2-steps mechanical process that allows us to easily get rid of the thick damage layer on the sheets before cavity forming. The process has been established on samples and extended to large disks ready for 1.3 GHz half-cell forming. The polished sheets will be then sent to KEK for half-cell forming and subsequent surface and material analysis before proceeding to half-cell welding. Former studies on the sample demonstrated that damages induced by forming can successfully be removed by recrystallization and less than 10 µm final chemistry.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 319
EP  - 322
KW  - SRF
KW  - cavity
KW  - niobium
KW  - laser
KW  - embedded
DA  - 2022/10
PY  - 2022
SN  - 2673-5504
SN  - 978-3-95450-233-2
DO  - doi:10.18429/JACoW-SRF2021-MOPFDV001
UR  - https://jacow.org/srf2021/papers/mopfdv001.pdf
ER  -