| Title |
Electrochemical Deposition of Nb₃Sn on the Surface of Cu Substrates |
| Authors |
- M. Lu, Q.W. Chu, Y. He, Z.Q. Lin, F. Pan, T. Tan, Z.Q. Yang
IMP/CAS, Lanzhou, People’s Republic of China
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| Abstract |
Coating superconducting Nb₃Sn thin film on the inner surface of a superconducting RF cavity is one of the most promising approaches to improve the performance of the accelerating cavity. Compared with traditional evaporation and sputtering, electrochemical coating has the advantages on process simplicity, low cost and mass production. However, the conventional electroplating, because of its low growth temperature and aqueous reaction environment, tends to produce porous, loosely bonded, and often contaminated film. All these properties result in excessive pinning center and deteriorate the superconducting radio frequency cavities performance. In this paper, a new method including multi-layer electroplating and heat treatment is used to deposit Nb₃Sn thin film on top of copper substrates. Important growth parameters, e.g. electrical current density, layer thickness ratio, and annealing temperature are studied. The morphology of the film surfaces was observed by scanning electron microscope (SEM) and the structure of the film was analyzed by X-ray diffraction (XRD). The results showed that a flat and uniform Nb₃Sn layer on copper can be obtained, and the thickness is about 7 micron.
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| Paper |
download TUP076.PDF [0.799 MB / 4 pages] |
| Poster |
download TUP076_POSTER.PDF [0.716 MB] |
| Export |
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| Conference |
SRF2019 |
| Series |
International Conference on RF Superconductivity (19th) |
| Location |
Dresden, Germany |
| Date |
30 June-05 July 2019 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Peter Michel (HZDR, Dresden, Germany); André Arnold (HZDR, Dresden, Germany); Volker RW Schaa (GSI, Darmstadt, Germany) |
| Online ISBN |
978-3-95450-211-0 |
| Online ISSN |
"" |
| Received |
23 June 2019 |
| Accepted |
01 July 2019 |
| Issue Date |
14 August 2019 |
| DOI |
doi:10.18429/JACoW-SRF2019-TUP076 |
| Pages |
624-627 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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