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RIS citation export for TUP076: Electrochemical Deposition of Nb₃Sn on the Surface of Cu Substrates

TY  - CONF
AU  - Lu, M.
AU  - Chu, Q.W.
AU  - He, Y.
AU  - Lin, Z.Q.
AU  - Pan, F.
AU  - Tan, T.
AU  - Yang, Z.Q.
ED  - Michel, Peter
ED  - Arnold, André
ED  - Schaa, Volker RW
TI  - Electrochemical Deposition of  Nb₃Sn on the Surface of Cu Substrates
J2  - Proc. of SRF2019, Dresden, Germany, 30 June-05 July 2019
CY  - Dresden, Germany
T2  - International Conference on RF Superconductivity
T3  - 19
LA  - english
AB  - Coating superconducting Nb₃Sn thin film on the inner surface of a superconducting RF cavity is one of the most promising approaches to improve the performance of the accelerating cavity. Compared with traditional evaporation and sputtering, electrochemical coating has the advantages on process simplicity, low cost and mass production. However, the conventional electroplating, because of its low growth temperature and aqueous reaction environment, tends to produce porous, loosely bonded, and often contaminated film. All these properties result in excessive pinning center and deteriorate the superconducting radio frequency cavities performance. In this paper, a new method including multi-layer electroplating and heat treatment is used to deposit Nb₃Sn thin film on top of copper substrates. Important growth parameters, e.g. electrical current density, layer thickness ratio, and annealing temperature are studied. The morphology of the film surfaces was observed by scanning electron microscope (SEM) and the structure of the film was analyzed by X-ray diffraction (XRD). The results showed that a flat and uniform Nb₃Sn layer on copper can be obtained, and the thickness is about 7 micron.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 624
EP  - 627
KW  - niobium
KW  - cavity
KW  - site
KW  - controls
KW  - SRF
DA  - 2019/08
PY  - 2019
SN  - ""
SN  - 978-3-95450-211-0
DO  - doi:10.18429/JACoW-SRF2019-TUP076
UR  - http://jacow.org/srf2019/papers/tup076.pdf
ER  -