Electrochemical Deposition of  Nb₃Sn on the Surface of Cu Substrates

Lu, Ming; Chu, Qingwei; He, Yuan; Lin, Zeqiang; Pan, Feng; Tan, Teng; Yang, Ziqin

doi:10.18429/JACoW-SRF2019-TUP076

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Text/Word citation export for TUP076: Electrochemical Deposition of Nb₃Sn on the Surface of Cu Substrates

M. Lu et al., “Electrochemical Deposition of Nb₃Sn on the Surface of Cu Substrates”, in Proc. SRF'19, Dresden, Germany, Jun.-Jul. 2019, pp. 624-627. doi:10.18429/JACoW-SRF2019-TUP076