Fermilab, Batavia, Illinois, USA
Northern Illinois University, DeKalb, USA
The prototype High-Beta 650 MHz cryomodule for the PIP-II project will be the first of its kind to be transported internationally, and the round trip from FNAL to STFC UKRI will use a combination of road and air transit. Transportation of an assembled cryomodule poses a significant technical challenge, as excitation can generate high stresses and cyclic loading. To accurately assess the behavior of the cryomodule, Finite Element Analysis (FEA) was used to analyze all major components. First, all individual components were studied. For the critical/complex components, the analysis was in fine detail. Afterwards, all models were brought to a simplified state (necessary for computational expenses), verified to have the same behavior as their detailed counterparts, and combined to form larger sub-assemblies, with the ultimate analysis including the full cryomodule. We report the criteria for acceptance and methods of analysis, and results for selected components and sub-assemblies.
