Title |
Tensile Tests of Large Grain Ingot Niobium at Liquid Helium Temperature |
Authors |
- M. Yamanaka
KEK, Ibaraki, Japan
- K. Enami
Tsukuba University, Ibaraki, Japan
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Abstract |
Tensile tests at liquid He temperature were performed using specimen taken from high purity large grain niobium ingot produced by CBMM. The measured RRR is 242. The ingot is 260 mm in diameter and sliced by a multi wire saw to 2.8 thickness. 5 specimens were cut off from one sliced disk. 3 disks were set in same phase to obtain same grain distribution. 3 specimens each of 5 grain patterns 5, 15 in total were used for the tensile test. The tensile test stand using a cryostat and liquid He was manufactured by ourselves. The measured tensile strength varied 379 to 808 MPa. The average value is 611 MPa. The tensile strength at room temperature is 84 MPa. The strength becomes high at low temperature like a fine grain niobium. The specimen includes a grain boundary, and causes the variation of strength. The different result was obtained in same grain patterns. The relationship between crystal orientation and strength is discussed.
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Paper |
download WEPFDV005.PDF [0.804 MB / 4 pages] |
Cite |
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Conference |
SRF2021 |
Series |
International Conference on RF Superconductivity (20th) |
Location |
East Lansing, MI, USA |
Date |
28 June-02 July 2021 |
Publisher |
JACoW Publishing, Geneva, Switzerland |
Editorial Board |
Kenji Saito (FRIB, MSU, East Lansing, MI, USA); Ting Xu (FRIB, MSU, East Lansing, MI, USA); Naruhiko Sakamoto (RIKEN, Wako, Japan); Ana Lesage (FRIB, MSU, East Lansing, MI, USA); Volker R.W. Schaa (GSI, Darmstadt, Germany) |
Online ISBN |
978-3-95450-233-2 |
Online ISSN |
2673-5504 |
Received |
08 June 2021 |
Accepted |
12 September 2021 |
Issue Date |
02 May 2022 |
DOI |
doi:10.18429/JACoW-SRF2021-WEPFDV005 |
Pages |
562-565 |
Copyright |
Published by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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