Author: Ishibashi, M.
Paper Title Page
MOPB063 Fundamental Studies for the STF-type Power Coupler for ILC 194
 
  • Y. Yamamoto, E. Kako, T. Matsumoto, S. Michizono, A. Yamamoto
    KEK, Ibaraki, Japan
  • M. Irikura, M. Ishibashi, H. Yasutake
    Toshiba Electron Tubes & Devices Co., Ltd (TETD), Tochigi, Japan
 
  From the view point of mass-production for the power coupler in ILC, the fundamental studies for the STF-type power coupler are under progress by the collaboration between KEK and TETD. At present, there are various rinsing procedures for power coupler in the world-wide laboratories. In this R&D, the main topic is to investigate the various rinsing effects in the copper plating and the ceramic through the high power test. In this paper, the first results will be presented.  
poster icon Poster MOPB063 [2.237 MB]  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-SRF2017-MOPB063  
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