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https://doi.org/10.18429/JACoW-IPAC2021-TUPAB267
Title Investigation of Beam Impedance and Heat Load in a High Temperature Superconducting Undulator
Authors
  • D. Astapovych, H. De Gersem, E. Gjonaj
    TEMF, TU Darmstadt, Darmstadt, Germany
  • T.A. Arndt, E. Bründermann, N. Glamann, A.W. Grau, B. Krasch, A.-S. Müller, R. Nast, D. Saez de Jauregui, A. Will
    KIT, Eggenstein-Leopoldshafen, Germany
Abstract The use of high temperature superconducting (HTS) materials can enhance the performance of superconducting undulators (SCU), which can later be implemented in free electron laser facilities, synchrotron storage rings and light sources. In particular, the short period < 10 mm undulators with narrow magnetic gap < 4 mm are relevant. One of the promising approaches considers a 10 cm meander-structured HTS tapes stacked one above the other. Then, the HTS tape is wound on the SCU. The idea of this jointless undulator has been proposed by, and is being further developed at KIT. Since minimizing the different sources of heat load is a critical issue for all SCUs, a detailed analysis of the impedance and heat load is required to meet the cryogenic system design. The dominant heat source is anticipated to be the resistive surface loss, which is one of the subjects of this study. Considering the complexity of the HTS tape, the impedance model includes the geometrical structure of the HTS tapes as well as the anomalous skin effect. The results of the numerical investigation performed by the help of the CST PS solver will be presented and discussed.
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Conference IPAC2021
Series International Particle Accelerator Conference (12th)
Location Campinas, SP, Brazil
Date 24-28 May 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-214-1
Online ISSN 2673-5490
Received 18 May 2021
Accepted 26 July 2021
Issue Date 12 August 2021
DOI doi:10.18429/JACoW-IPAC2021-TUPAB267
Pages 2089-2092
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.