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RIS citation export for TUPAB267: Investigation of Beam Impedance and Heat Load in a High Temperature Superconducting Undulator

TY  - CONF
AU  - Astapovych, D.
AU  - Arndt, T.A.
AU  - Bründermann, E.
AU  - De Gersem, H.
AU  - Gjonaj, E.
AU  - Glamann, N.
AU  - Grau, A.W.
AU  - Krasch, B.
AU  - Müller, A.-S.
AU  - Nast, R.
AU  - Saez de Jauregui, D.
AU  - Will, A.
ED  - Liu, Lin
ED  - Byrd, John M.
ED  - Neuenschwander, Regis T.
ED  - Picoreti, Renan
ED  - Schaa, Volker R. W.
TI  - Investigation of Beam Impedance and Heat Load in a High Temperature Superconducting Undulator
J2  - Proc. of IPAC2021, Campinas, SP, Brazil, 24-28 May 2021
CY  - Campinas, SP, Brazil
T2  - International Particle Accelerator Conference
T3  - 12
LA  - english
AB  - The use of high temperature superconducting (HTS) materials can enhance the performance of superconducting undulators (SCU), which can later be implemented in free electron laser facilities, synchrotron storage rings and light sources. In particular, the short period < 10 mm undulators with narrow magnetic gap < 4 mm are relevant. One of the promising approaches considers a 10 cm meander-structured HTS tapes stacked one above the other. Then, the HTS tape is wound on the SCU. The idea of this jointless undulator has been proposed by, and is being further developed at KIT. Since minimizing the different sources of heat load is a critical issue for all SCUs, a detailed analysis of the impedance and heat load is required to meet the cryogenic system design. The dominant heat source is anticipated to be the resistive surface loss, which is one of the subjects of this study. Considering the complexity of the HTS tape, the impedance model includes the geometrical structure of the HTS tapes as well as the anomalous skin effect. The results of the numerical investigation performed by the help of the CST PS solver will be presented and discussed.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 2089
EP  - 2092
KW  - undulator
KW  - impedance
KW  - laser
KW  - simulation
KW  - site
DA  - 2021/08
PY  - 2021
SN  - 2673-5490
SN  - 978-3-95450-214-1
DO  - doi:10.18429/JACoW-IPAC2021-TUPAB267
UR  - https://jacow.org/ipac2021/papers/tupab267.pdf
ER  -