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https://doi.org/10.18429/JACoW-IPAC2021-THPAB320
Title ALD-Based NbTiN Studies for SIS R&D
Authors
  • I. González Díaz-Palacio, R.H. Blick, R. Zierold
    University of Hamburg, Hamburg, Germany
  • W. Hillert, M. Wenskat
    University of Hamburg, Institut für Experimentalphysik, Hamburg, Germany
Abstract Superconductor-Insulator-Superconductor multilayers improve the performance of SRF cavities providing magnetic screening of the bulk cavity and lower surface resistance. In this framework NbTiN mixtures stand as a potential material of interest. Atomic layer deposition (ALD) allows for uniform coating of complex geometries and enables tuning of the stoichiometry and precise thickness control in sub-nm range. In this talk, we report about NbTiN thin films deposited by plasma-enhanced ALD on insulating AlN buffer layer. The deposition process has been optimized by studying the superconducting electrical properties of the films. Post-deposition thermal annealing studies with varying temperatures, annealing times, and gas atmospheres have been performed to further improve the thin film quality and the superconducting properties. Our experimental studies show an increase in Tc by 87.5% after thermal annealing and a maximum Tc of 13.9 K has been achieved for NbTiN of 23 nm thickness. Future steps include lattice characterization, using XRR/XRD/EBSD/PALS, and SRF measurements to obtain Hc1 and the superconducting gap.
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Conference IPAC2021
Series International Particle Accelerator Conference (12th)
Location Campinas, SP, Brazil
Date 24-28 May 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-214-1
Online ISSN 2673-5490
Received 24 May 2021
Accepted 23 July 2021
Issue Date 18 August 2021
DOI doi:10.18429/JACoW-IPAC2021-THPAB320
Pages 4420-4421
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.