Author: Chalker, P.
Paper Title Page
MOPVA100 Atomic Layer Deposition of Niobium Nitride from Different Precursors 1094
 
  • P. Pizzol, P. Chalker, J.W. Roberts, J. Wrench
    The University of Liverpool, Liverpool, United Kingdom
  • O.B. Malyshev, R. Valizadeh
    STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom
 
  Advancements in technology have taken bulk niobium cavities close to their theoretical operational limits of 45 MV/m, pushing the research to explore novel materials, such as niobium based alloys . Theoretical studies suggest that a composite material composed of alternative superconductor / insulator multilayers would surpass the bulk niobium limits. Chemical vapour deposition (CVD) can deposit mi-crons thick Nb films in less than an hour, at the expense of precise thickness control. Atomic layer deposition (ALD), instead, even if considerably slower than CVD can be used in applications where the thickness of the deposited layers needs to be controlled with a resolution down to the nanometer. This article presents the preliminary results obtained by using plasma assisted ALD techniques to deposit NbN based compounds starting from chlorinated precursors and organic ones, and the design for a new deposition system currently being built at the Daresbury Laboratories.  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2017-MOPVA100  
Export • reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)