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MOPB059 | Field Emission Investigation of Centrifugal-Barrel-Polished Nb Samples | 237 |
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Funding: This work was funded by BMBF project 05H12PX6. Actual and future SRF-accelerators require high accelerating gradient Eacc and quality factor Q0, which are often limited by enhanced field emission (EFE)* caused by surface roughness or particulates**. Various expensive surface preparation techniques (e.g. BCP, EP, HPR etc.) have been developed to obtain the required surface quality and remove the emitters. Recently, centrifugal barrel polishing (CBP) has been reconsidered to obtain a comparable surface roughness as EP with less effort***. We have started to investigate Nb samples, which were prepared as coupons in a single cell 1.3 GHz cavity by an optimized five step CBP process with a final dry ice cleaning. EFE maps showed the first emitter (1 nA) at 60 MV/m, and 32 emitters at 110 MV/m. SEM/EDX analysis of the emitting sites revealed many Al2O3 inclusions with sharp edges. Therefore, subsequent BCP (~20 μm removal) was applied to the sample. Surface analysis as well as EFE characterization of CBP treated Nb coupons with/without BCP step will be presented. *D. Reschke et al., THPP021, LINAC14. **A. Navitski et al., PRSTAB 16, 112001 (2013). ***C.A. Cooper, L.D. Cooley, Supercond. Sci. Technol. 26, 015011 (2013). |
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MOPB073 | Surface Analyses and Optimization of Centrifugal Barrel Polishing of Nb Cavities | 286 |
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Funding: BMBF project 05H12GU9, Alexander von Humboldt Foundation, and CRISP (No. 283745). Centrifugal barrel polishing (CBP) is an acid-free surface-polishing technique based on abrasive media. It considerably reduces the usage of chemicals in the preparation of Nb cavities, typically leaving only a final light electropolishing (EP) and achieves considerably smaller roughness than in chemical treatments alone. CBP addresses in particular the removal of pits, welding spatters, deep scratches, and foreign material inclusions that occasionally occur in the production process. A mirror-smooth surface without chemical contamination is also an important enabling step for thin films. Recent results indicate, however, the need of further optimizations, mainly to reduce the surface damaged layer as well as the pollution by the polishing media. A dedicated study of the CBP process using a “coupon” cavity facilitates better polishing characterisation and optimisation by direct measurements of the roughness, removal rate, and removal profile as well as the amount of contamination left behind and determination of a best combination of the CBP and chemical polishing. Results of the coupon-studies and perspectives of the optimizations will be presented and discussed. |
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MOPB113 | Study of the Evolution of Artificial Defects on the Surface of Niobium During Electrochemical and Chemical Polishing | 433 |
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The presence of defects on the inner surface of Nb superconducting RF structures might limit its final performance. For this reason, strict requirements are imposed during mechanical production of the cavities, specifically on the quality control of the inner surface of components, to avoid the presence of defects or scratches. Nevertheless, some defects may remain also after control or can arise from the following production steps. Understanding the evolution of the defect might shine new insight on its origin and help in defining possible repair techniques. This paper reports the topographical evolution of defects on a Nb sample polished with the standard recipe used for the 1.3 GHz cavities of the EXFEL project. Various artificial defects of different shape, dimensions, and thicknesses/depths, with geometrical characteristics similar to the one that may occur during the machining and handling of cavities, have been “ad hoc” produced on the sample of the same material used for the cell fabrication. Analysis shows the evolution of the shape and profile of the defects at the different polishing steps. | ||
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