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| TUPMA003 |
Microbunching Phenomena in LCLS-II |
1843 |
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- M. Venturini, C. F. Papadopoulos, J. Qiang
LBNL, Berkeley, California, USA
- Y. Ding, P. Emma, Z. Huang, G. Marcus, A. Marinelli, Y. Nosochkov, T.O. Raubenheimer, L. Wang, M. Woodley
SLAC, Menlo Park, California, USA
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Funding: Work supported by DOE, in part under Contract No. DE-AC02-05CH11231 and through the LCLS-II project.
The microbunching instability has long been recognized as a potential limiting factor to the performance of X-ray FELs. It is of particular relevance in LCLS-II due, in part, to a layout that includes a long bypass beamline between the Linac and the undulators. Here we focus on two aspects of the instability that highlight the importance of 3D effects.
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| DOI • |
reference for this paper
※ https://doi.org/10.18429/JACoW-IPAC2015-TUPMA003
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| WEYC1 |
Technical Challenges of the LCLS-II |
2434 |
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- T.O. Raubenheimer
SLAC, Menlo Park, California, USA
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The LCLS-II will be a CW X-ray FEL upgrade to the existing LCLS X-ray FEL at the SLAC National Accelerator Laboratory (SLAC). This paper describes the overall layout and the technical challenges that the upgrade project faces.
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Slides WEYC1 [4.446 MB]
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| DOI • |
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※ https://doi.org/10.18429/JACoW-IPAC2015-WEYC1
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| WEPWI007 |
TTF3 Power Coupler Thermal Analysis for LCLS-II CW Operation |
3503 |
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- L. Xiao, C. Adolphsen, Z. Li, C.D. Nantista, T.O. Raubenheimer
SLAC, Menlo Park, California, USA
- I.V. Gonin, N. Solyak
Fermilab, Batavia, Illinois, USA
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The TESLA 9-cell SRF cavity design has been adopted for use in the LCLS-II SRF Linac. Its TTF3 coaxial Fundamental Power Coupler (FPC), developed for pulsed operation in the European XFEL and ILC, requires modest changes to make it suitable for LCLS-II CW operation, in which it must be able to handle up to 7 kW of average power with the maximum temperature rise not to exceed 150 C. In order to improve TTF3 FPC cooling, an increased copper plating thickness will be used on the inner and outer conductor stainless steel RF surfaces. Fully 3D FPC thermal analysis with copper plating was performed using the SLAC developed parallel finite element code suite ACE3P with integrated electromagnetic, thermal and mechanical multi-physics simulation capabilities. In this paper, we present TTF3 FPC thermal analysis simulation results obtained using ACE3P as well as a comparison with measurement results.
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| DOI • |
reference for this paper
※ https://doi.org/10.18429/JACoW-IPAC2015-WEPWI007
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