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Title The Software-Based Machine Protection System Using EPICS in J-PARC MR
  • K.C. Sato, N. Kamikubota, T. Kimura, S. Yamada, N. Yamamoto
    J-PARC, KEK & JAEA, Ibaraki-ken, Japan
  • S.Y. Yoshida
    Kanto Information Service (KIS), Accelerator Group, Ibaraki, Japan
Abstract In J-PARC, a Machine Protection System (MPS) stops accelerator beam operation automatically when an interlock signal comes. Normal MPS accepts interlock signals by hard-wire, but a software-based MPS, called "Soft-MPS", uses only EPICS PVs without wiring. A PLC controller running Linux was introduced to watch at some EPICS PVs over Ethernet, and outputs Soft-MPS signals to the MPS unit after logical calculates. There are 2 reasons of using Soft-MPS. (1) To install interlock signals rapidly. This type of Soft-MPS will switch to hard-wire later. (2) To use non-hardware parameters: for example, machine operation modes, beam bunch information, etc. From the first Soft-MPS setup in 2018 spring, 9 Soft-MPS signals are currently used. As more Soft-MPS signals are expected in the future, we need to discuss the policy.
Paper download WEPHA136.PDF [1.151 MB / 3 pages]
Poster download WEPHA136_POSTER.PDF [1.544 MB]
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Conference ICALEPCS2019
Series International Conference on Accelerator and Large Experimental Physics Control Systems (17th)
Location New York, NY, USA
Date 05-11 October 2019
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Karen S. White (ORNL, Oak Ridge, TN, USA); Kevin A. Brown (BNL, Upton, NY, USA); Philip S. Dyer (BNL, Upton, NY, USA); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-209-7
Online ISSN 2226-0358
Received 28 October 2019
Accepted 03 November 2019
Issue Date 30 August 2020
DOI doi:10.18429/JACoW-ICALEPCS2019-WEPHA136
Pages 1418-1420
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.