SRF2021 - List of Authors (Khare, P.)

Paper	Title	Page
WEPTEV015	Design of the 650 MHz High Beta Prototype Cryomodule for PIP-II at Fermilab	671
	V. Roger, S.K. Chandrasekaran, S. Cheban, M. Chen, J. Helsper, J.P. Holzbauer, Y.M. Orlov, V. Poloubotko, B. Squires, N. Tanovic, G. Wu Fermilab, Batavia, Illinois, USA N. Bazin, O. Napoly, C. Simon CEA-DRF-IRFU, France R. Cubizolles, M. Lacroix CEA-IRFU, Gif-sur-Yvette, France M.T.W. Kane STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom P. Khare RRCAT, Indore (M.P.), India
	Funding: This manuscript has been authored by Fermi Research Alliance, LLC under Contract No. DE-AC02-07CH11359 with the U.S. Department of Energy, Office of Science, Office of High Energy Physics The Proton Improvement Plan II (PIP-II) is the first U.S. accelerator project that will have significant contributions from international partners. The prototype High Beta 650 MHz cryomodule (pHB650 CM) is designed by an integrated design team, consisting of Fermilab (USA), CEA (France), UKRI-STFC (UK), and RRCAT (India). The manufacturing & assembly of this prototype cryomodule will be done at Fermilab, whereas the production cryomodules will be manufactured and/or assembled by UKRI-STFC, RRCAT, or Fermilab. Similar to the prototype Single Spoke Resonator 1 cryomodule (pSSR1 CM), this cryomodule is based on a strong-back at room temperature supporting the coldmass. The pSSR1 CM led to significant lessons being learnt on the design, procurement, and assembly processes. These lessons were incorporated into the design and processes for the pHB650 CM. Amongst many challenges faced, the main challenges of the pHB650 CM design were to make the cryomodule compatible to overseas transportation and to design components that can be procured in USA, Europe, and India.
	Poster WEPTEV015 [0.937 MB]
DOI •	reference for this paper ※ doi:10.18429/JACoW-SRF2021-WEPTEV015
About •	Received ※ 21 June 2021 — Revised ※ 28 February 2022 — Accepted ※ 20 April 2022 — Issue date ※ 16 May 2022
Cite •	reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)

Paper

Title

Page

Design of the 650 MHz High Beta Prototype Cryomodule for PIP-II at Fermilab

671

V. Roger, S.K. Chandrasekaran, S. Cheban, M. Chen, J. Helsper, J.P. Holzbauer, Y.M. Orlov, V. Poloubotko, B. Squires, N. Tanovic, G. Wu
Fermilab, Batavia, Illinois, USA
N. Bazin, O. Napoly, C. Simon
CEA-DRF-IRFU, France
R. Cubizolles, M. Lacroix
CEA-IRFU, Gif-sur-Yvette, France
M.T.W. Kane
STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom
P. Khare
RRCAT, Indore (M.P.), India

Funding: This manuscript has been authored by Fermi Research Alliance, LLC under Contract No. DE-AC02-07CH11359 with the U.S. Department of Energy, Office of Science, Office of High Energy Physics
The Proton Improvement Plan II (PIP-II) is the first U.S. accelerator project that will have significant contributions from international partners. The prototype High Beta 650 MHz cryomodule (pHB650 CM) is designed by an integrated design team, consisting of Fermilab (USA), CEA (France), UKRI-STFC (UK), and RRCAT (India). The manufacturing & assembly of this prototype cryomodule will be done at Fermilab, whereas the production cryomodules will be manufactured and/or assembled by UKRI-STFC, RRCAT, or Fermilab. Similar to the prototype Single Spoke Resonator 1 cryomodule (pSSR1 CM), this cryomodule is based on a strong-back at room temperature supporting the coldmass. The pSSR1 CM led to significant lessons being learnt on the design, procurement, and assembly processes. These lessons were incorporated into the design and processes for the pHB650 CM. Amongst many challenges faced, the main challenges of the pHB650 CM design were to make the cryomodule compatible to overseas transportation and to design components that can be procured in USA, Europe, and India.

Poster WEPTEV015 [0.937 MB]

DOI •

reference for this paper ※ doi:10.18429/JACoW-SRF2021-WEPTEV015

About •

Received ※ 21 June 2021 — Revised ※ 28 February 2022 — Accepted ※ 20 April 2022 — Issue date ※ 16 May 2022

Cite •

reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)