JACoW is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.
@inproceedings{sun:srf2021-weotev03,
author = {Z. Sun and T. Arias and Z. Baraissov and K.D. Dobson and G. Gaitan and M. Ge and K. Howard and M.M. Kelley and M. Liepe and D.A. Muller and T.E. Oseroff and R.D. Porter and J.P. Sethna and N. Sitaraman},
% author = {Z. Sun and T. Arias and Z. Baraissov and K.D. Dobson and G. Gaitan and M. Ge and others},
% author = {Z. Sun and others},
title = {{Toward Stoichiometric and Low-Surface-Roughness Nb₃Sn Thin Films via Direct Electrochemical Deposition}},
booktitle = {Proc. SRF'21},
% booktitle = {Proc. 20th International Conference on RF Superconductivity (SRF'21)},
pages = {710--713},
eid = {WEOTEV03},
language = {english},
keywords = {cavity, SRF, superconductivity, electron, radio-frequency},
venue = {East Lansing, MI, USA},
series = {International Conference on RF Superconductivity},
number = {20},
publisher = {JACoW Publishing, Geneva, Switzerland},
month = {10},
year = {2022},
issn = {2673-5504},
isbn = {978-3-95450-233-2},
doi = {10.18429/JACoW-SRF2021-WEOTEV03},
url = {https://jacow.org/srf2021/papers/weotev03.pdf},
abstract = {{Reducing surface roughness and attaining stoichiometry of Nb₃Sn superconducting films are required to push their superheating field to the theoretical limit in SRF cavities. As such, we explore direct electrochemical processes that minimize involving foreign elements to deposit high-quality Sn, Nb, and NbxSn films on Nb and Cu surfaces. These films are then thermally annealed to Nb₃Sn. We find that smooth Sn pre-depositions via electroplating on Nb surfaces significantly reduce the average roughness of resultant Nb₃Sn to 65 nm, with a dramatic reduction in power intensity at medium special frequencies. Structural and superconducting properties demonstrate a Nb₃Sn A15 phase with a stoichiometry of 25 at% Sn. This process is being scaled-up to a 3.9 GHz cavity. Moreover, preliminary results on electroplating on Cu surface show that Nb plating undergoes a slow growth rate while subsequent Sn plating on the plated Nb surface can be controlled with varied thickness. The Nb plating process is currently being optimized.}},
}