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RIS citation export for THPCAV003: Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity

TY  - CONF
AU  - Nii, K.
AU  - Chouhan, V.
AU  - Hayano, H.
AU  - Ida, Y.I.
AU  - Kato, S.
AU  - Monjushiro, H.
AU  - Saeki, T.
AU  - Yamaguchi, T.Y.
ED  - Saito, Kenji
ED  - Xu, Ting
ED  - Sakamoto, Naruhiko
ED  - Lesage, Ana
ED  - Schaa, Volker R.W.
TI  - Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity
J2  - Proc. of SRF2021, East Lansing, MI, USA, 28 June-02 July 2021
CY  - East Lansing, MI, USA
T2  - International Conference on RF Superconductivity
T3  - 20
LA  - english
AB  - We have been developing a vertical electropolishing (VEP) method for niobium superconducting RF cavities using a novel setup that allows periodic flipping of the cavity to put it upside down in the VEP process. The purpose of using the novel setup named as flipping system is to achieve uniform removal and smooth surface of the cavity. Previously, we have already introduced the VEP system and showed the preliminary results of VEP performed with the flipping system. In this article, we report VEP results obtained with a nine-cell coupon cavity. The results include detail on coupon currents with I-V curves for coupons, and impact of the cavity flipping on removal uniformity and surface morphology of the cavity.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 783
EP  - 786
KW  - cavity
KW  - cathode
KW  - experiment
KW  - niobium
KW  - status
DA  - 2022/10
PY  - 2022
SN  - 2673-5504
SN  - 978-3-95450-233-2
DO  - doi:10.18429/JACoW-SRF2021-THPCAV003
UR  - https://jacow.org/srf2021/papers/thpcav003.pdf
ER  -