JACoW is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.
@inproceedings{nii:srf2021-thpcav003,
author = {K. Nii and V. Chouhan and H. Hayano and Y.I. Ida and S. Kato and H. Monjushiro and T. Saeki and T.Y. Yamaguchi},
% author = {K. Nii and V. Chouhan and H. Hayano and Y.I. Ida and S. Kato and H. Monjushiro and others},
% author = {K. Nii and others},
title = {{Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity}},
booktitle = {Proc. SRF'21},
% booktitle = {Proc. 20th International Conference on RF Superconductivity (SRF'21)},
pages = {783--786},
eid = {THPCAV003},
language = {english},
keywords = {cavity, cathode, experiment, niobium, status},
venue = {East Lansing, MI, USA},
series = {International Conference on RF Superconductivity},
number = {20},
publisher = {JACoW Publishing, Geneva, Switzerland},
month = {10},
year = {2022},
issn = {2673-5504},
isbn = {978-3-95450-233-2},
doi = {10.18429/JACoW-SRF2021-THPCAV003},
url = {https://jacow.org/srf2021/papers/thpcav003.pdf},
abstract = {{We have been developing a vertical electropolishing (VEP) method for niobium superconducting RF cavities using a novel setup that allows periodic flipping of the cavity to put it upside down in the VEP process. The purpose of using the novel setup named as flipping system is to achieve uniform removal and smooth surface of the cavity. Previously, we have already introduced the VEP system and showed the preliminary results of VEP performed with the flipping system. In this article, we report VEP results obtained with a nine-cell coupon cavity. The results include detail on coupon currents with I-V curves for coupons, and impact of the cavity flipping on removal uniformity and surface morphology of the cavity.}},
}