JACoW is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.
TY - CONF AU - Pira, C. AU - Azzolini, O. AU - Caforio, R. AU - Chyhyrynets, E. AU - Garcia, V.A. AU - Keppel, G. AU - Stivanello, F. ED - Saito, Kenji ED - Xu, Ting ED - Sakamoto, Naruhiko ED - Lesage, Ana ED - Schaa, Volker R.W. TI - Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF J2 - Proc. of SRF2021, East Lansing, MI, USA, 28 June-02 July 2021 CY - East Lansing, MI, USA T2 - International Conference on RF Superconductivity T3 - 20 LA - english AB - Superconducting radio frequency (SRF) cavities performances strongly depend on the substrate preparation. Currently, the conventional protocol of SRF surface preparation includes electropolishing (EP) as the main treatment achieving low roughness, clean and non-contaminated surfaces, both for bulk Nb and Cu substrates. Harsh and non-environmentally friendly solutions are typically used: HF and H₂SO₄ mixture for Nb, and H3PO4 with Butanol mixtures for EP of Cu. This research is focused on the application of a relatively new technique "Plasma Electrolytic Polishing" (PEP) for the SRF needs. PEP technology is an evolution of EP with a list of advantages that SRF community can benefit from. PEP requires diluted salt solutions moving to a greener approach in respect to EP. PEP can in principle substitute, or completely eliminate, intermediate steps, like mechanical and/or (electro) chemical polishing. Thanks to the superior removing rate in the field (up to 3.5 µm/min of Nb, and 10 µm/min of Cu) in one single treatment roughness below 100 nm Ra has been obtained both for Nb and Cu. In the present work a proof of concept is shown on Nb and Cu planar samples. PB - JACoW Publishing CP - Geneva, Switzerland SP - 718 EP - 724 KW - plasma KW - cavity KW - SRF KW - niobium KW - cathode DA - 2022/10 PY - 2022 SN - 2673-5504 SN - 978-3-95450-233-2 DO - doi:10.18429/JACoW-SRF2021-THOTEV06 UR - https://jacow.org/srf2021/papers/thotev06.pdf ER -