JACoW is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.
@inproceedings{pira:srf2021-thotev06,
author = {C. Pira and O. Azzolini and R. Caforio and E. Chyhyrynets and V.A. Garcia and G. Keppel and F. Stivanello},
% author = {C. Pira and O. Azzolini and R. Caforio and E. Chyhyrynets and V.A. Garcia and G. Keppel and others},
% author = {C. Pira and others},
title = {{Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF}},
booktitle = {Proc. SRF'21},
% booktitle = {Proc. 20th International Conference on RF Superconductivity (SRF'21)},
pages = {718--724},
eid = {THOTEV06},
language = {english},
keywords = {plasma, cavity, SRF, niobium, cathode},
venue = {East Lansing, MI, USA},
series = {International Conference on RF Superconductivity},
number = {20},
publisher = {JACoW Publishing, Geneva, Switzerland},
month = {10},
year = {2022},
issn = {2673-5504},
isbn = {978-3-95450-233-2},
doi = {10.18429/JACoW-SRF2021-THOTEV06},
url = {https://jacow.org/srf2021/papers/thotev06.pdf},
abstract = {{Superconducting radio frequency (SRF) cavities performances strongly depend on the substrate preparation. Currently, the conventional protocol of SRF surface preparation includes electropolishing (EP) as the main treatment achieving low roughness, clean and non-contaminated surfaces, both for bulk Nb and Cu substrates. Harsh and non-environmentally friendly solutions are typically used: HF and H₂SO₄ mixture for Nb, and H3PO4 with Butanol mixtures for EP of Cu. This research is focused on the application of a relatively new technique "Plasma Electrolytic Polishing" (PEP) for the SRF needs. PEP technology is an evolution of EP with a list of advantages that SRF community can benefit from. PEP requires diluted salt solutions moving to a greener approach in respect to EP. PEP can in principle substitute, or completely eliminate, intermediate steps, like mechanical and/or (electro) chemical polishing. Thanks to the superior removing rate in the field (up to 3.5 µm/min of Nb, and 10 µm/min of Cu) in one single treatment roughness below 100 nm Ra has been obtained both for Nb and Cu. In the present work a proof of concept is shown on Nb and Cu planar samples.}},
}