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'Journal of Accelerator Conferences Website' (JACoW) is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.


https://doi.org/10.18429/JACoW-SRF2021-TUPFDV008
Title Instrumentation R&D for the Studies of SRF Thin-Film Structures at KEK and Kyoto University
Authors
  • Y. Fuwa
    JAEA/J-PARC, Tokai-mura, Japan
  • H. Hayano, H. Ito, R. Katayama, T. Kubo, T. Saeki
    KEK, Ibaraki, Japan
  • Y. Iwashita, Y. Kuriyama
    Kyoto University, Research Reactor Institute, Osaka, Japan
  • H. Tongu
    Kyoto ICR, Uji, Kyoto, Japan
Abstract We have been developing SRF instrumentations by which the effective lower critical magnetic field H_{c1,eff} of superconducting-material sample is evaluated through the method of the third-order harmonic voltage measurement mainly for the studies of new SRF thin-film structures. Recently, the quad coil system, which enables us to measure four samples simultaneously in a single batch of an experiment, has been developed. In order to study the creation of thin-film structures inside the SRF cavity, we developed 3-GHz-shaped coupon cavities and an XT-map system for the performance tests of 3 GHz cavities. This article reports the details of these works.
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Conference SRF2021
Series International Conference on RF Superconductivity (20th)
Location East Lansing, MI, USA
Date 28 June-02 July 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Kenji Saito (FRIB, MSU, East Lansing, MI, USA); Ting Xu (FRIB, MSU, East Lansing, MI, USA); Naruhiko Sakamoto (RIKEN, Wako, Japan); Ana Lesage (FRIB, MSU, East Lansing, MI, USA); Volker R.W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-233-2
Online ISSN 2673-5504
Received 01 July 2021
Revised 19 December 2021
Accepted 02 April 2022
Issue Date 02 May 2022
DOI doi:10.18429/JACoW-SRF2021-TUPFDV008
Pages 421-425
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.