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TY - CONF AU - Dai, J. AU - He, P. AU - Li, Z.Q. AU - Ma, Y. AU - Yang, F.Y. AU - Zhang, P. ED - Michel, Peter ED - Arnold, André ED - Schaa, Volker RW TI - The Development of Niobium Sputtering on Copper Cavities at IHEP J2 - Proc. of SRF2019, Dresden, Germany, 30 June-05 July 2019 CY - Dresden, Germany T2 - International Conference on RF Superconductivity T3 - 19 LA - english AB - A R&D program focusing on niobium sputtering on copper cavities started at IHEP in 2017. Single-cell 1.3 GHz elliptical cavity shape has been initially chosen as sputtering substrate. A magnetron sputtering system have been developed in 2018. In addition, a surface treatment facility to polish the copper substrate before sputtering has been developed and commissioned. This paper will present the Nb/Cu coating activities at IHEP. PB - JACoW Publishing CP - Geneva, Switzerland SP - 613 EP - 615 KW - cavity KW - niobium KW - vacuum KW - SRF KW - photon DA - 2019/08 PY - 2019 SN - "" SN - 978-3-95450-211-0 DO - doi:10.18429/JACoW-SRF2019-TUP072 UR - http://jacow.org/srf2019/papers/tup072.pdf ER -