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BiBTeX citation export for MOP083: R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR

@InProceedings{okii:srf2019-mop083,
  author       = {Y. Okii and E. Kako and S. Michizono and J. Taguchi and H. Takahashi and Y. Yamamoto and H. Yasutake},
% author       = {Y. Okii and E. Kako and S. Michizono and J. Taguchi and H. Takahashi and Y. Yamamoto and others},
% author       = {Y. Okii and others},
  title        = {{R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR}},
  booktitle    = {Proc. SRF'19},
  pages        = {278--281},
  paper        = {MOP083},
  language     = {english},
  keywords     = {SRF, experiment, target, electron, ECR},
  venue        = {Dresden, Germany},
  series       = {International Conference on RF Superconductivity},
  number       = {19},
  publisher    = {JACoW Publishing, Geneva, Switzerland},
  month        = {aug},
  year         = {2019},
  issn         = {""},
  isbn         = {978-3-95450-211-0},
  doi          = {10.18429/JACoW-SRF2019-MOP083},
  url          = {http://jacow.org/srf2019/papers/mop083.pdf},
  note         = {https://doi.org/10.18429/JACoW-SRF2019-MOP083},
}