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Title	FRIB Solenoid Package in Cryomodule and Local Magnetic Shield
Authors	K. Saito, H. Ao, B. Bird, R. Bliton, N.K. Bultman, F. Casagrande, C. Compton, J. Curtin, K. Elliott, A. Ganshyn, W. Hartung, L. Hodges, K. Holland, S.H. Kim, S.M. Lidia, D. Luo, S.J. Miller, D.G. Morris, L. Nguyen, D. Norton, J.T. Popielarski, L. Popielarski, T. Russo, J.F. Schwartz, S.M. Shanab, M. Shuptar, D.R. Victory, C. Wei, J. Wei, M. Xu, T. Xu, Y. Yamazaki, C. Zhang, Q. Zhao FRIB, East Lansing, Michigan, USA A. Facco INFN/LNL, Legnaro (PD), Italy K. Hosoyama, M. Masuzawa KEK, Ibaraki, Japan R.E. Laxdal TRIUMF, Vancouver, Canada
Abstract	FRIB cryomodule design has a feature: solenoid package(s) and local magnetic shields in the cryomodule. In this design, exposing SRF cavities to a very strong fringe field from the solenoid is concerned. A tangled issue between solenoid package design and magnetic shield one has to be resolved. FRIB made intensive studies, designed, prototyped, validated the solenoid packages and magnetic shields, and finally certified them in the bunker test. This paper reports activity results, and LS1 commissioning results in FRIB tunnel. This is a FRIB success story.
Funding	U.S. Department of Energy Office of Science under Cooperative Agreement DE -SC0000661
Paper	download MOP072.PDF [13.859 MB / 6 pages]
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Conference	SRF2019
Series	International Conference on RF Superconductivity (19th)
Location	Dresden, Germany
Date	30 June-05 July 2019
Publisher	JACoW Publishing, Geneva, Switzerland
Editorial Board	Peter Michel (HZDR, Dresden, Germany); André Arnold (HZDR, Dresden, Germany); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN	978-3-95450-211-0
Online ISSN	""
Received	24 June 2019
Accepted	14 August 2019
Issue Date	14 August 2019
DOI	doi:10.18429/JACoW-SRF2019-MOP072
Pages	235-240
Copyright	Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.