Author: Umezawa, H.
Paper Title Page
MOPB061 Quality Control of Copper Plating in STF-2 Input Power Couplers 186
 
  • E. Kako, R. Ueki
    KEK, Ibaraki, Japan
  • K. Hiroaki, J. Taguchi
    Nomura Plating Co, Ltd., Osaka, Japan
  • K. Okihira, K. Sennyu
    MHI, Hiroshima, Japan
  • F. Saito, H. Umezawa
    Tokyo Denkai Co., Ltd., Tokyo, Japan
  • O. Yushiro
    Toshiba Electron Tubes & Devices Co., Ltd, Tokyo, Japan
  
  Purity of thin copper plating using in input power couplers for superconducting cavities is one of important characteristics for considering thermal losses at low temperature. Various samples of thin copper plating on stainless sheets was fabricated by three companies with their own plating techniques. The RRR values of the samples with different thickness of copper plating were compared in the condition before and after heat treatment at 800oC in a brazing furnace. Deterioration of the RRR was observed in all of samples after heat treatment. The results of the RRR measurements and sample analysis of impurities will be reported in this paper.  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-SRF2017-MOPB061  
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