SRF2017 - List of Authors (Taguchi, J.)

Paper	Title	Page
MOPB061	Quality Control of Copper Plating in STF-2 Input Power Couplers	186
	E. Kako, R. Ueki KEK, Ibaraki, Japan K. Hiroaki, J. Taguchi Nomura Plating Co, Ltd., Osaka, Japan K. Okihira, K. Sennyu MHI, Hiroshima, Japan F. Saito, H. Umezawa Tokyo Denkai Co., Ltd., Tokyo, Japan O. Yushiro Toshiba Electron Tubes & Devices Co., Ltd, Tokyo, Japan
	Purity of thin copper plating using in input power couplers for superconducting cavities is one of important characteristics for considering thermal losses at low temperature. Various samples of thin copper plating on stainless sheets was fabricated by three companies with their own plating techniques. The RRR values of the samples with different thickness of copper plating were compared in the condition before and after heat treatment at 800oC in a brazing furnace. Deterioration of the RRR was observed in all of samples after heat treatment. The results of the RRR measurements and sample analysis of impurities will be reported in this paper.
DOI •	reference for this paper ※ https://doi.org/10.18429/JACoW-SRF2017-MOPB061
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TUPB097	R&D of Electro-polishing (EP) Process with HF-free Neutral Electrolyte by Bipolar-pulse (BP) Method	623
	J. Taguchi, Y. Mochida, T. Nakajima Nomura Plating Co, Ltd., Osaka, Japan H. Hayano, T. Saeki KEK, Ibaraki, Japan S. Kakudo, M. Kunieda The University of Tokyo, Tokyo, Japan
	Currently the Electro-Polishing (EP) process of Superconducting Radio-Frequency (SRF) accelerating cavity is performed with the electrolyte that is the mixture of hydrofluoric and sulfuric acids. However, the electrolyte is very dangerous and the environmental load in the disposal process of electrolyte is very heavy. This is the reason why the high cost is necessary in the safe design of facility and the safe operation of process in the conventional EP method. In such situation, considering the reduction of cost and environmental load in the EP process, we performed the R&D of novel EP process with HF-free neutral electrolyte by Bipolar-Pulse (BP) method. In this presentation, we will report the removal rate, surface roughness and the results of surface analysis for the Nb-coupon samples that were processed by the BP-EP with HF-free neutral electrolyte.
DOI •	reference for this paper ※ https://doi.org/10.18429/JACoW-SRF2017-TUPB097
Export •	reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)

Paper

Title

Page

Quality Control of Copper Plating in STF-2 Input Power Couplers

186

E. Kako, R. Ueki
KEK, Ibaraki, Japan
K. Hiroaki, J. Taguchi
Nomura Plating Co, Ltd., Osaka, Japan
K. Okihira, K. Sennyu
MHI, Hiroshima, Japan
F. Saito, H. Umezawa
Tokyo Denkai Co., Ltd., Tokyo, Japan
O. Yushiro
Toshiba Electron Tubes & Devices Co., Ltd, Tokyo, Japan

Purity of thin copper plating using in input power couplers for superconducting cavities is one of important characteristics for considering thermal losses at low temperature. Various samples of thin copper plating on stainless sheets was fabricated by three companies with their own plating techniques. The RRR values of the samples with different thickness of copper plating were compared in the condition before and after heat treatment at 800oC in a brazing furnace. Deterioration of the RRR was observed in all of samples after heat treatment. The results of the RRR measurements and sample analysis of impurities will be reported in this paper.

DOI •

reference for this paper ※ https://doi.org/10.18429/JACoW-SRF2017-MOPB061

Export •

reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)

TUPB097

R&D of Electro-polishing (EP) Process with HF-free Neutral Electrolyte by Bipolar-pulse (BP) Method

623

J. Taguchi, Y. Mochida, T. Nakajima
Nomura Plating Co, Ltd., Osaka, Japan
H. Hayano, T. Saeki
KEK, Ibaraki, Japan
S. Kakudo, M. Kunieda
The University of Tokyo, Tokyo, Japan

Currently the Electro-Polishing (EP) process of Superconducting Radio-Frequency (SRF) accelerating cavity is performed with the electrolyte that is the mixture of hydrofluoric and sulfuric acids. However, the electrolyte is very dangerous and the environmental load in the disposal process of electrolyte is very heavy. This is the reason why the high cost is necessary in the safe design of facility and the safe operation of process in the conventional EP method. In such situation, considering the reduction of cost and environmental load in the EP process, we performed the R&D of novel EP process with HF-free neutral electrolyte by Bipolar-Pulse (BP) method. In this presentation, we will report the removal rate, surface roughness and the results of surface analysis for the Nb-coupon samples that were processed by the BP-EP with HF-free neutral electrolyte.

DOI •

reference for this paper ※ https://doi.org/10.18429/JACoW-SRF2017-TUPB097

Export •

reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)