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TY - CPAPER AU - Chouhan, V. AU - Hayano, H. AU - Ida, Y.I. AU - Ishimi, K. AU - Kato, S. AU - Monjushiro, H. AU - Nii, K.N. AU - Saeki, T. AU - Sawabe, M. AU - Yamaguchi, T.Y. TI - Recent Development in Vertical Electropolishing J2 - Proc. of International Conference on RF Superconductivity (SRF2015), Whistler, BC, Canada, Sept. 13-18, 2015 AB - Horizontal electropolishing (HEP) is being used for final surface treatment of niobium SRF cavities. However a HEP system is equipped with complicated mechanism that makes it expensive and enhances cost of surface treatment of cavities especially when mass production is considered. Vertical electropolishing (VEP) has been introduced by other labs and the research is being carried out to establish the VEP technique. The VEP system requires simple mechanism and has advantages over HEP setup. Positive results have been obtained from the VEPed cavities also as shown by other labs. However further improvement in a VEP setup, cathode and VEP parameters is required. Marui Galvanizing Co., Ltd in collaboration with KEK has been working for development of VEP system, optimization of cathode and VEP parameters to obtain uniform Nb removal with a smooth surface of a cavity. Here we report our recent development of VEP system, unique Ninja cathode and parameter optimization with a 1-cell coupon cavity containing 6 Nb disk coupons at the beam pipes, irises and equator. The coupon surfaces were analyzed to obtain detail of the cavity surface. PB - JACoW CY - Geneva, Switzerland SP - 1024 EP - 1030 KW - cavity KW - cathode KW - experiment KW - ion KW - SRF DA - 2015/12 PY - 2015 SN - 978-3-95450-178-6 DO - 10.18429/JACoW-SRF2015-THBA02 UR - http://srf2015.vrws.de/papers/thba02.pdf ER -