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We have developed an experimental research program to the study of the photoemission properties of copper photocathodes as a function of various plasma cleaning/etching parameters. The quantum efficiency, QE, and topology, Ra and Rpp, of Copper Photocathodes, , will be monitored while undergoing plasma cleaning/etching process. We will monitor the QE as a function of time for the various test coupons while we optimize the various plasma processing parameters. In addition, surface topology, will be studied to determine the suitability of the cleaning/etching process to produce an acceptable photoemitter. We propose to use two metrics in the evaluation of the plasma cleaning process as an acceptable cleaning method for metallic photocathodes, Quantum Efficiency versus Wavelength and Surface roughness: Ra and Rpp represent the Average Roughness and Peak to Peak Roughness parameters, respectively.
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