JACoW is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.
@inproceedings{francisco:medsi2023-tupyp004,
author = {B.A. Francisco and D.Y. Kakizaki and V.C. Kuriyama and A. Lopes Ribeiro and M. Saveri Silva and W.H. Wilendorf and V.B. Zilli and G.S. de Albuquerque and J.H. dos Santos},
% author = {B.A. Francisco and D.Y. Kakizaki and V.C. Kuriyama and A. Lopes Ribeiro and M. Saveri Silva and W.H. Wilendorf and others},
% author = {B.A. Francisco and others},
title = {{A Setup for the Evaluation of Thermal Contact Resistance at Cryogenic Temperatures Under Controlled Pressure Rates}},
% booktitle = {Proc. MEDSI'23},
booktitle = {Proc. 12th Int. Conf. Mech. Eng. Design Synchrotron Radiat. Equip. Instrum. (MEDSI'23)},
eventdate = {2023-11-06/2023-11-10},
pages = {37--39},
paper = {TUPYP004},
language = {english},
keywords = {cryogenics, radiation, vacuum, interface, alignment},
venue = {Beijing, China},
series = {International Conference on Mechanical Engineering Design of Synchrotron Radiation Equipment and Instrumentation},
number = {12},
publisher = {JACoW Publishing, Geneva, Switzerland},
month = {07},
year = {2024},
issn = {2673-5520},
isbn = {978-3-95450-250-9},
doi = {10.18429/JACoW-MEDSI2023-TUPYP004},
url = {https://jacow.org/medsi2023/papers/tupyp004.pdf},
abstract = {{The design of optical elements compass different development areas, such as optics, structures and dynamics, thermal, and control. In particular, the thermal designs of mirrors aim to minimize deformations, whose usual requirements are around 5 nm RMS and slope errors in the order of 150 nrad RMS. One of the main sources of uncertainties in thermal designs is the inconsistency in values of thermal contact resistances (TCR) found in the literature. A device based on the ASTM D5470 standard was proposed and designed to measure the TCR among materials commonly used in mirror systems. Precision engineering design tools were used to deal with the challenges related to the operation at cryogenic temperatures (145 K) and under several pressures rates (1~10 MPa) whilst ensuring the alignment between the specimens. We observed using indium as Thermal Interface Material reduced the TCR in 10~42,2\% for SS316/Cu contacts, and 31~81\% for Al/Cu. Upon analyzing the measurements, we identified some areas for improvements in the equipment, such as mitigating radiation and improving the heat flow in the cold part of the system that were implemented for the upgraded version.}},
}