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RIS citation export for THOB01: Thermal Contact Conductance in a Typical Silicon Crystal Assembly Found in Particle Accelerators

AU  - Sanchez Navarro, P.
ED  - Jaski, Yifei
ED  - Den Hartog, Patric
ED  - Jaje, Kelly
ED  - Schaa, Volker R.W.
TI  - Thermal Contact Conductance in a Typical Silicon Crystal Assembly Found in Particle Accelerators
J2  - Proc. of MEDSI2020, Chicago, IL, USA, 24-29 July 2021
CY  - Chicago, IL, USA
T2  - Mechanical Engineering Design of Synchrotron Radiation Equipment and Instrumentation
T3  - 11
LA  - english
AB  - Every mirror at Diamond Light Source (the UK’s Particle Accelerator) has been installed with the premise of clamping the cooling copper manifolds as lightly as possible to minimize distortion. The problem with this approach is that the Thermal Contact Conductance (TCC) depends on the applied pressure among other factors*. The assembly is usually a symmetric stack of Copper - Indium Foil - Silicon Crystal - Indium Foil - Copper. Variables that interest the most are those that are easily adjustable in the set-up assembly (number of clamps, pressure applied and cooling water flow rate) PT100 temperature sensors have been used along the surface of the crystal and along the surface of the copper manifolds. Custom PCB units have been created for this project to act as a mean of collecting data and Matlab has been used to plot the temperature measurements vs. time. Another challenge is the creation of an accurate model in Ansys that matches reality up to a good compromise where the data that is being recorded from the sensors matches Ansys results within reason.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 353
EP  - 356
KW  - interface
KW  - simulation
KW  - controls
KW  - experiment
DA  - 2021/10
PY  - 2021
SN  - 2673-5520
SN  - 978-3-95450-229-5
DO  - doi:10.18429/JACoW-MEDSI2020-THOB01
UR  - https://jacow.org/medsi2020/papers/thob01.pdf
ER  -