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Title A Review of Ultrasonic Additive Manufacturing for Particle Accelerator Applications
  • J.A. Brandt
    Enrico Fermi Institute, University of Chicago, Chicago, Illinois, USA
Abstract Additive manufacturing (AM) technologies have been used for prototyping and production parts in many industries. However, due to process limitations and the unknown material properties of AM parts, there has been limited adoption of the technology in accelerator and light-source facilities. Ultrasonic Additive Manufacturing (UAM) is a hybrid additive-subtractive manufacturing process that uses a solid-state ultrasonic bonding mechanism attached to a CNC mill to join and machine metal parts in a layer-by-layer manner. The solid-state and hybrid nature of UAM ensures base material properties are retained and mitigates process limitations which traditionally inhibit integration of parts produced by other AM processes. This paper presents a review of the UAM process and its potential application to accelerator and beamline needs. Several specific areas are discussed including: replacement of traditional manufacturing approaches, such as explosion bonding to join dissimilar metals; improved internal cooling channel fabrication for thermal management; and imbedding of electronics and materials for more accurate remote sensing and radiation shielding.
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Conference MEDSI2020
Series Mechanical Engineering Design of Synchrotron Radiation Equipment and Instrumentation (11th)
Location Chicago, IL, USA
Date 24-29 July 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Yifei Jaski (ANL, Lemont, IL, USA); Patric Den Hartog (ANL, Lemont, IL, USA); Kelly Jaje (ANL, Lemont, IL, USA); Volker R.W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-229-5
Online ISSN 2673-5520
Received 22 July 2021
Accepted 16 October 2021
Issue Date 05 November 2021
DOI doi:10.18429/JACoW-MEDSI2020-TUPC06
Pages 185-188
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.