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TUPLB10 |
Non-destructive Real-time Monitor to Measure 3D-bunch Charge Distribution with Arrival Timing to Maximize 3D Overlapping for HHG-seeded EUV-FEL |
467 |
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- H. Tomizawa, K. Ogawa, T. Sato, M. Yabashi
RIKEN SPring-8 Center, Sayo-cho, Sayo-gun, Hyogo, Japan
- M. Aoyama
JAEA/Kansai, Kyoto, Japan
- A. Iwasaki, S. Owada
The University of Tokyo, Tokyo, Japan
- S. Matsubara, Y. Okayasu, T. Togashi
JASRI/SPring-8, Hyogo, Japan
- T. Matsukawa, H. Minamide
RIKEN ASI, Sendai, Miyagi, Japan
- E. Takahashi
RIKEN, Saitama, Japan
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Non-destructive, shot-by-shot real-time monitors have been developed to measure 3D bunch charge distribution (BCD). This 3D monitor has been developed to monitor 3-D overlapping electron bunches and higher harmonic generation (HHG) pulses in a seeded VUV-FEL. This ambitious monitor is based on an Electro-Optic (EO) multiple sampling technique in a manner of spectral decoding that is non-destructive and enables real-time measurements of the longitudinal and transverse BCD. This monitor was materialized in simultaneously probing eight EO crystals that surround the electron beam axis with a radial polarized and hollow EO-probe laser pulse. In 2009, the concept of 3D-BCD monitor was verified through electron bunch measurements at SPring-8. The further target of the temporal resolution is ~30 fs (FWHM), utilizing an organic EO crystal (DAST) instead of conventional inorganic EO crystals (ZnTe, GaP, etc.) The EO-sampling with DAST crystal is expected to measure a bunch length less than 30 fs (FWHM). In 2011, the first bunch measurement with an organic EO crystal (DAST) was successfully demonstrated in the VUV-FEL accelerator at SPring-8.
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Slides TUPLB10 [2.713 MB]
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TUPB080 |
Non-destructive Real-time Monitor to Measure 3D Bunch Charge Distribution with Arrival Timing to Maximize 3D Overlapping for HHG-Seeded EUV-FEL |
657 |
|
- H. Tomizawa, K. Ogawa, T. Sato, M. Yabashi
RIKEN SPring-8 Center, Sayo-cho, Sayo-gun, Hyogo, Japan
- M. Aoyama
JAEA/Kansai, Kyoto, Japan
- A. Iwasaki, S. Owada
The University of Tokyo, Tokyo, Japan
- S. Matsubara, Y. Okayasu, T. Togashi
JASRI/SPring-8, Hyogo, Japan
- T. Matsukawa, H. Minamide
RIKEN ASI, Sendai, Miyagi, Japan
- E. Takahashi
RIKEN, Saitama, Japan
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Non-destructive, shot-by-shot real-time monitors have been developed to measure 3D bunch charge distribution (BCD). This 3D monitor has been developed to monitor 3D overlapping electron bunches and higher harmonic generation (HH) pulses in a seeded VUV-FEL. This ambitious monitor is based on an Electro-Optic (EO) multiple sampling technique in a manner of spectral decoding that is non-destructive and enables real-time measurements of the longitudinal and transverse BCD. This monitor was materialized in simultaneously probing eight EO crystals that surround the electron beam axis with a radial polarized and hollow EO-probe laser pulse. In 2009, the concept of 3D-BCD monitor was verified through electron bunch measurements at SPring-8. The further target of the temporal resolution is ~30 fs (FWHM), utilizing an organic EO crystal (DAST) instead of conventional inorganic EO crystals (ZnTe, GaP, etc.) The EO-sampling with DAST crystal is expected to measure a bunch length less than 30 fs (FWHM). In 2011, the first bunch measurement with an organic EO crystal (DAST) was successfully demonstrated in the VUV-FEL accelerator at SPring-8.
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