The electrodeposition of copper onto niobium using commercial acidic and alkaline electrolytes was tested. The continuous dense polycrystalline copper films were successfully obtained in aqueous alkaline-type bath containing copper sulphate, sodium hydroxide and sodium gluconate. The effect of benzotriazole and sodi-um lauryl sulphate additives on the morphology and crystal structure of the deposited copper was investigat-ed by optical and scanning electron microscopy, and X-ray diffraction. No copper oxides were found in the grown films. Copper films had moderate adhesion properties that would be insufficient for cryocooler application. We are currently exploring different com-positions of electrolyte baths for obtaining the coatings on niobium with improved adhesion.