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RIS citation export for THPAB341: TiN Metalizing and Coating for Multi-Megawatt RF Vacuum Windows

TY  - CONF
AU  - Neubauer, M.L.
AU  - Dudas, A.
AU  - Johnson, R.P.
ED  - Liu, Lin
ED  - Byrd, John M.
ED  - Neuenschwander, Regis T.
ED  - Picoreti, Renan
ED  - Schaa, Volker R. W.
TI  - TiN Metalizing and Coating for Multi-Megawatt RF Vacuum Windows
J2  - Proc. of IPAC2021, Campinas, SP, Brazil, 24-28 May 2021
CY  - Campinas, SP, Brazil
T2  - International Particle Accelerator Conference
T3  - 12
LA  - english
AB  - Coatings on microwave windows and high-voltage ceramics are required to eliminate secondary electron emission (SEE), which initiates multipactoring discharge causing local heating and ceramic failures due to cracking and loss of vacuum. The region surrounding the triple junction (ceramic+metal+vacuum) is the primary source of free electrons and in microwave windows and high-voltage ceramics. This region is located at the metalizing and braze joint of the ceramic support structure making the vacuum seal. On very large microwave windows typically at low frequencies, this critical region is difficult to coat by the traditional techniques of sputter coating anti-multipactoring titanium nitride or other materials. The novel processes proposed here include a means for applying and controlling the thickness of titanium nitride both in the metallizing (controlling the source) and on the surface of the window, eliminating SEE and the multipactoring discharge.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 4457
EP  - 4460
KW  - Windows
KW  - electron
KW  - vacuum
KW  - multipactoring
KW  - high-voltage
DA  - 2021/08
PY  - 2021
SN  - 2673-5490
SN  - 978-3-95450-214-1
DO  - doi:10.18429/JACoW-IPAC2021-THPAB341
UR  - https://jacow.org/ipac2021/papers/thpab341.pdf
ER  -