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@inproceedings{neubauer:ipac2021-thpab341,
author = {M.L. Neubauer and A. Dudas and R.P. Johnson},
title = {{TiN Metalizing and Coating for Multi-Megawatt RF Vacuum Windows}},
booktitle = {Proc. IPAC'21},
pages = {4457--4460},
eid = {THPAB341},
language = {english},
keywords = {Windows, electron, vacuum, multipactoring, high-voltage},
venue = {Campinas, SP, Brazil},
series = {International Particle Accelerator Conference},
number = {12},
publisher = {JACoW Publishing, Geneva, Switzerland},
month = {08},
year = {2021},
issn = {2673-5490},
isbn = {978-3-95450-214-1},
doi = {10.18429/JACoW-IPAC2021-THPAB341},
url = {https://jacow.org/ipac2021/papers/thpab341.pdf},
note = {https://doi.org/10.18429/JACoW-IPAC2021-THPAB341},
abstract = {{Coatings on microwave windows and high-voltage ceramics are required to eliminate secondary electron emission (SEE), which initiates multipactoring discharge causing local heating and ceramic failures due to cracking and loss of vacuum. The region surrounding the triple junction (ceramic+metal+vacuum) is the primary source of free electrons and in microwave windows and high-voltage ceramics. This region is located at the metalizing and braze joint of the ceramic support structure making the vacuum seal. On very large microwave windows typically at low frequencies, this critical region is difficult to coat by the traditional techniques of sputter coating anti-multipactoring titanium nitride or other materials. The novel processes proposed here include a means for applying and controlling the thickness of titanium nitride both in the metallizing (controlling the source) and on the surface of the window, eliminating SEE and the multipactoring discharge.}},
}