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Title Demonstration FELs Using UC-XFEL Technologies at the SAMURAI Laboratory
  • N. Majernik, G. Andonian, O. Camacho, A. Fukasawa, G.E. Lawler, W.J. Lynn, B. Naranjo, J.B. Rosenzweig, Y. Sakai, O. Williams
    UCLA, Los Angeles, California, USA
  • R. Robles
    SLAC, Menlo Park, California, USA
Abstract The ultra-compact x-ray free-electron laser (UC-XFEL), described in [J. B. Rosenzweig, et al. 2020 New J. Phys. 22 093067], combines several cutting edge beam physics techniques and technologies to realize an x-ray free electron laser at a fraction of the cost and footprint of existing XFEL installations. These elements include cryogenic, normally conducting RF structures for both the gun and linac, IFEL bunch compression, and short-period undulators. In this work, several stepping-stone, demonstrator scenarios under discussion for the UCLA SAMURAI Laboratory are detailed and simulated, employing different subsets of these elements. The cost, footprint, and technology risk for these scenarios are considered in addition to the anticipated engineering and physics experience gained.
Funding DOE HEP Grant DE-SC0020409, National Science Foundation Grant No. PHY-1549132
Paper download TUPAB092.PDF [0.266 MB / 4 pages]
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Conference IPAC2021
Series International Particle Accelerator Conference (12th)
Location Campinas, SP, Brazil
Date 24-28 May 2021
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-214-1
Online ISSN 2673-5490
Received 19 May 2021
Accepted 11 August 2021
Issue Date 02 September 2021
DOI doi:10.18429/JACoW-IPAC2021-TUPAB092
Pages 1592-1595
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.