IPAC2017 - List of Authors (Lebet, S.)

Paper	Title	Page
THPAB039	Novel Manufacturing Concepts for 12 GHz High Gradient Accelerating Structures	3787
	A. Solodko, S. Atieh, N. Catalán Lasheras, A. Grudiev, S. Lebet, W. Wuensch CERN, Geneva, Switzerland H. Zha TUB, Beijing, People's Republic of China
	CLIC high gradient accelerating structures (AS) work-ing in X-band are made of copper ultra-high precision discs, requiring both milling and turning operations. Discs are then joint together by diffusion bonding. The rest of important technical systems, such as vacuum, cooling and manifolds, to house damping silicon carbide absorbers, are brazed to the bonded disc stack afterwards. This manufacturing technique has been successfully demonstrated but it is very challenging and needs an accurate assembly at every production step. Main issues concern vacuum-tightness, misalignment, deformations during different assembly operations, defects of braz-ing/bonding operations (gaps, a leak of brazing material) etc. Preparation and repairs are time and resource con-suming and increase the final price of the accelerating structure. This paper describes the novel manufacturing concepts for 12 GHz high gradient AS and focuses on new joining techniques as electron beam welding or brazing, new engineering solutions, as rectangular cells or structures made of halves are being considered.
DOI •	reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2017-THPAB039
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Paper

Title

Page

Novel Manufacturing Concepts for 12 GHz High Gradient Accelerating Structures

3787

A. Solodko, S. Atieh, N. Catalán Lasheras, A. Grudiev, S. Lebet, W. Wuensch
CERN, Geneva, Switzerland
H. Zha
TUB, Beijing, People's Republic of China

CLIC high gradient accelerating structures (AS) work-ing in X-band are made of copper ultra-high precision discs, requiring both milling and turning operations. Discs are then joint together by diffusion bonding. The rest of important technical systems, such as vacuum, cooling and manifolds, to house damping silicon carbide absorbers, are brazed to the bonded disc stack afterwards. This manufacturing technique has been successfully demonstrated but it is very challenging and needs an accurate assembly at every production step. Main issues concern vacuum-tightness, misalignment, deformations during different assembly operations, defects of braz-ing/bonding operations (gaps, a leak of brazing material) etc. Preparation and repairs are time and resource con-suming and increase the final price of the accelerating structure. This paper describes the novel manufacturing concepts for 12 GHz high gradient AS and focuses on new joining techniques as electron beam welding or brazing, new engineering solutions, as rectangular cells or structures made of halves are being considered.

DOI •

reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2017-THPAB039

Export •

reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)