IPAC2011 - List of Authors (Aicheler, M.)

Paper	Title	Page
TUPS098	Machining and Characterizing X-band RF-structures for CLIC	1768
	S. Atieh, M. Aicheler, G. Arnau-Izquierdo, A. Cherif, L. Deparis, D. Glaude, L. Remandet, G. Riddone, M. Scheubel CERN, Geneva, Switzerland D. Gudkov, A. Samoshkin, A. Solodko JINR, Dubna, Moscow Region, Russia
	The Compact Linear Collider (CLIC) is currently under study at CERN as a potential multi-TeV e+e collider. The manufacturing and assembling tolerances for making the required RF components are essential for CLIC to perform efficiently. Machining techniques are relevant to the construction of ultra-high-precision parts for the Accelerating Structures (AS). Optical-quality turning and ultra-precision milling using diamond tools are the main manufacturing techniques identified to produce ultra-high shape accuracy parts. A shape error of less than 5 micrometres and roughness of Ra 0.025 are achieved. Scanning Electron Microscopy (SEM) observation as well as sub-micron precision Coordinate Measuring Machines (CMM), roughness measurements and their crucial environment were implemented at CERN for quality assurance and further development. This paper focuses on the enhancements of precision machining and characterizing the fabrication of AS parts.

TUPS099	A Study of the Surface Quality of High Purity Copper after Heat Treatment	1771
	M. Aicheler, G. Arnau-Izquierdo, S. Atieh, S. Calatroni, S. Lebet, G. Riddone, A. Samoshkin CERN, Geneva, Switzerland
	The manufacturing flow of accelerating structures for the compact linear collider, based on diamond-machined high purity copper components, include several thermal cycles (diffusion bonding, brazing of cooling circuits, baking in vacuum, etc.). The high temperature cycles may be carried out following different schedules and environments (vacuum, reducing hydrogen atmosphere, argon, etc.) and develop peculiar surface topographies which have been the object of extended observations. This study presents and discusses the results of scanning electron microscopy (SEM) and optical microscopy investigations.

Paper

Title

Page

Machining and Characterizing X-band RF-structures for CLIC

1768

S. Atieh, M. Aicheler, G. Arnau-Izquierdo, A. Cherif, L. Deparis, D. Glaude, L. Remandet, G. Riddone, M. Scheubel
CERN, Geneva, Switzerland
D. Gudkov, A. Samoshkin, A. Solodko
JINR, Dubna, Moscow Region, Russia

The Compact Linear Collider (CLIC) is currently under study at CERN as a potential multi-TeV e+e collider. The manufacturing and assembling tolerances for making the required RF components are essential for CLIC to perform efficiently. Machining techniques are relevant to the construction of ultra-high-precision parts for the Accelerating Structures (AS). Optical-quality turning and ultra-precision milling using diamond tools are the main manufacturing techniques identified to produce ultra-high shape accuracy parts. A shape error of less than 5 micrometres and roughness of Ra 0.025 are achieved. Scanning Electron Microscopy (SEM) observation as well as sub-micron precision Coordinate Measuring Machines (CMM), roughness measurements and their crucial environment were implemented at CERN for quality assurance and further development. This paper focuses on the enhancements of precision machining and characterizing the fabrication of AS parts.

TUPS099

A Study of the Surface Quality of High Purity Copper after Heat Treatment

1771

M. Aicheler, G. Arnau-Izquierdo, S. Atieh, S. Calatroni, S. Lebet, G. Riddone, A. Samoshkin
CERN, Geneva, Switzerland

The manufacturing flow of accelerating structures for the compact linear collider, based on diamond-machined high purity copper components, include several thermal cycles (diffusion bonding, brazing of cooling circuits, baking in vacuum, etc.). The high temperature cycles may be carried out following different schedules and environments (vacuum, reducing hydrogen atmosphere, argon, etc.) and develop peculiar surface topographies which have been the object of extended observations. This study presents and discusses the results of scanning electron microscopy (SEM) and optical microscopy investigations.