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https://doi.org/10.18429/JACoW-ICAP2018-SUPAF07
Title High-Fidelity Three-Dimensional Simulations of Thermionic Energy Converters
Authors
  • N.M. Cook, J.P. Edelen, C.C. Hall, M.V. Keilman, P. Moeller, R. Nagler
    RadiaSoft LLC, Boulder, Colorado, USA
  • J.-L. Vay
    LBNL, Berkeley, California, USA
Abstract Thermionic energy converters (TEC) are a class of thermoelectric devices, which promise improvements to the efficiency and cost of both small- and large-scale electricity generation. A TEC is comprised of a narrowly-separated thermionic emitter and an anode. Simple structures are often space-charge limited as operating temperatures produce currents exceeding the Child-Langmuir limit. We present results from 3D simulations of these devices using the particle-in-cell code Warp, developed at Lawrence Berkeley National Lab. We demonstrate improvements to the Warp code permitting high fidelity simulations of complex device geometries. These improvements include modeling of non-conformal geometries using mesh refinement and cut-cells with a dielectric solver. We also consider self-consistent effects to model Schottky emission near the space-charge limit for arrays of shaped emitters. The efficiency of these devices is computed by modeling distinct loss channels, including kinetic losses, radiative losses, and dielectric charging. We demonstrate many of these features within an open-source, browser-based interface for running 3D electrostatic simulations with Warp, including design and analysis tools, as well as streamlined submission to HPC centers.
Funding This work is supported the US DOE Office of Science, Office of High Energy Physics: DE-SC0017162.
Paper download SUPAF07.PDF [1.048 MB / 5 pages]
Slides download SUPAF07_TALK.PDF [6.097 MB]
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Conference ICAP2018
Series International Computational Accelerator Physics Conference (13th)
Location Key West, FL, USA
Date 20-24 October 2018
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Volker RW Schaa (GSI, Darmstadt, Germany); Kyoko Makino (MSU, East Lansing, MI, USA); Pavel Snopok (IIT, Chicago, IL, USA); Martin Berz (MSU, East Lansing, MI, USA)
Online ISBN 978-3-95450-200-4
Received 01 November 2018
Accepted 19 November 2018
Issue Date 04 May 2019
DOI doi:10.18429/JACoW-ICAP2018-SUPAF07
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.