Title |
LCLS-II Cryomodule Isolation Vacuum Pump System |
Authors |
- S.C. Alverson, D.K. Gill, S. Saraf
SLAC, Menlo Park, California, USA
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Abstract |
The LCLS-II Project at SLAC National Accelerator is a major upgrade to the lab’s Free Electron Laser (FEL) facility adding a new injector and superconducting linac. In order to support this new linac, a vacuum pumping scheme was needed to isolate the liquid helium lines cooling the RF cavities inside the cryomodules from outside ambient heat as well as to exhaust any leaking helium gas. Carts were built with support for both roughing and high vacuum pumps and read back diagnostics. Additionally, a Programmable Logic Controller (PLC) was then configured to automate the pump down sequence and provide interlocks in the case of a vacuum burst. The design was made modular such that it can be manually relocated easily to other sections of the linac if needed depending on vacuum conditions.
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Footnotes & References |
* https://lcls.slac.stanford.edu/lcls-ii |
Funding |
Work supported by the U.S. Department of Energy under contract number DE-AC02-76SF00515 |
Paper |
download THPDP086.PDF [2.037 MB / 5 pages] |
Poster |
download THPDP086_POSTER.PDF [18.551 MB] |
Cite |
download ※ BibTeX
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Conference |
ICALEPCS2023 |
Series |
International Conference on Accelerator and Large Experimental Physics Control Systems (19th) |
Location |
Cape Town, South Africa |
Date |
09-13 October 2023 |
Publisher |
JACoW Publishing, Geneva, Switzerland |
Editorial Board |
Volker RW Schaa (GSI, Darmstadt, Germany); Andy Götz (ESRF, Grenoble, France); Johan Venter (SARAO, Cape Town, South Africa); Karen White (SNS, Oak Ridge, TN, USA); Marie Robichon (ESRF, Grenoble, France); Vivienne Rowland (SARAO, Cape Town, South Africa) |
Online ISBN |
978-3-95450-238-7 |
Online ISSN |
2226-0358 |
Received |
03 October 2023 |
Revised |
27 October 2023 |
Accepted |
06 December 2023 |
Issued/td>
| 15 December 2023 |
DOI |
doi:10.18429/JACoW-ICALEPCS2023-THPDP086 |
Pages |
1551-1555 |
Copyright |
Published by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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