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'Journal of Accelerator Conferences Website' (JACoW) is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.


https://doi.org/10.18429/JACoW-IBIC2023-TUP046
Title Status of the RFSoC-based Signal Processing for Multi-bunch and Filling Pattern Feedbacks in the SLS 2.0
Authors
  • P.H. Baeta Neves Diniz Santos
    PSI, Villigen PSI, Switzerland
Abstract Having effectively evaluated the RF System-On-Chip (RFSoC) as a suitable technology for the SLS2.0 Filling Pattern Feedback (FPFB) and Multi-bunch Feedback (MBFB) [1], our current focus lies in realizing and expanding the required real-time Digital Signal Processing (DSP) algorithms on an RFSoC evaluation board. This contribution outlines the present status of our feedback systems, including recent outcomes derived from testing prototypes both in the laboratory and with beam signals at the storage ring.
Footnotes & References [1] P. Baeta et al., "RF System-on-Chip for Multi-Bunch and Filling-Pattern Feedbacks," Proc. IBIC’22
Paper download TUP046.PDF [0.380 MB / 4 pages]
Poster download TUP046_POSTER.PDF [1.201 MB]
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Conference IBIC2023
Series International Beam Instrumentation Conference (12th)
Location Saskatoon, Canada
Date 10-14 September 2023
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Volker R.W. Schaa (GSI, Darmstadt, Germany); Tonia Batten (CLS, Saskatoon, Canada); Michael Bree (CLS, Saskatoon, Canada); Christine Petit-Jean-Genaz (CERN, Geneva, Switzerland); Darren Hunter (CLS, Saskatoon, Canada)
Online ISBN 978-3-95450-236-3
Online ISSN 2673-5350
Received 30 August 2023
Revised 09 September 2023
Accepted 12 September 2023
Issue Date 29 September 2023
DOI doi:10.18429/JACoW-IBIC2023-TUP046
Pages 297-300
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 4.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.