Title |
Development of a Thermal Response Model for Wire Grid Profile Monitors and Benchmarking to CERN LINAC4 Experiments |
Authors |
- A. Navarro Fernandez, F. Roncarolo
CERN, Geneva, Switzerland
- M. Sapinski
GSI, Darmstadt, Germany
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Abstract |
The operation of wire grids as beam profile monitors, both in terms of measurement accuracy and wire integrity, can be heavily affected by the thermal response of the wires to the energy deposited by the charged particles. A comprehensive model to describe such interaction has been implemented including beam induced heating, all relevant cooling processes and the various phenomena contributing to the wire signal such as secondary emission and H⁻ electron scattering. The output from this model gives a prediction of the wire signal and temperature evolution under different beam conditions. The model has been applied to the wire grids of the CERN LINAC4 160 MeV H-beam and compared to experimental measurements. This successful benchmarking allowed the model to be used to review the beam power limits for operating wire grids in LINAC4.
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Paper |
download TUPP35.PDF [1.579 MB / 4 pages] |
Poster |
download TUPP35_POSTER.PDF [1.241 MB] |
Export |
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Conference |
IBIC2020 |
Series |
International Beam Instrumentation Conference (9th) |
Location |
Santos, Brazil |
Date |
14-18 September 2020 |
Publisher |
JACoW Publishing, Geneva, Switzerland |
Editorial Board |
Daniel Tavares (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Gustavo Bruno (LNLS, Campinas, Brazil); Sergio Marques (LNLS, Campinas, Brazil); Volker R.W. Schaa (GSI, Darmstadt, Germany) |
Online ISBN |
978-3-95450-222-6 |
Online ISSN |
2673-5350 |
Received |
14 September 2020 |
Accepted |
28 October 2020 |
Issue Date |
30 October 2020 |
DOI |
doi:10.18429/JACoW-IBIC2020-TUPP35 |
Pages |
82-85 |
Copyright |
Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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