| Paper |
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Page |
| THPC037 |
Studies of Orthogonal Bumps for ILC Main Linac
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3059 |
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- N. Solyak
Fermilab, Batavia, Illinois
- S. A. Glukhov
BINP SB RAS, Novosibirsk
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To preserve small vertical emittance of the beam in ILC main linac a few beam-based alignment techniques were proposed and studied in recent years. Dispersion and wakefield bumps are one of the effective tool for final tuning of the machine. One of the modifications of bumps is so called orthogonal (or SVD) bumps, proposed for CLIC. In paper we present study of orthogonal bumps performances for final alignment of the ILC main linac.
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