| Paper | Title | Page |
|---|---|---|
| TUPCH126 | Outgassing Rate of Highly Pure Copper Electroplating Applied to RF Cavities | 1307 |
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| We plan to apply a new copper electroplating with a high purity and a high electric conductivity to normal-conducting RF cavities for electron or positron storage rings with a high current beam. As reported in 2005 Particle Accelerator Conference, our first test cavity, made of iron, with the electroplated copper surface finished up by electropolishing showed an excellent electric performance compared with the case of cavities made of oxygen free copper. Our next step is to examine the vacuum performance. This paper reports results of the outgassing-rate measurements on our second test cavity together with its fabrication process. |