| Paper |
Title |
Page |
| TUPCH126 |
Outgassing Rate of Highly Pure Copper Electroplating Applied to RF Cavities
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1307 |
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- T. Abe, T. Kageyama, Y. Saito, H. Sakai, Y. Sato, Y. Takeuchi
KEK, Ibaraki
- Z. Kabeya, T. Kawasumi
MHI, Nagoya
- T. Nakamura, S. Nishihashi, K. Tsujimoto
Asahi Kinzoku Co., Ltd., Gifu
- K. Tajiri
Churyo Engineering Co., Ltd., Nagoya
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We plan to apply a new copper electroplating with a high purity and a high electric conductivity to normal-conducting RF cavities for electron or positron storage rings with a high current beam. As reported in 2005 Particle Accelerator Conference, our first test cavity, made of iron, with the electroplated copper surface finished up by electropolishing showed an excellent electric performance compared with the case of cavities made of oxygen free copper. Our next step is to examine the vacuum performance. This paper reports results of the outgassing-rate measurements on our second test cavity together with its fabrication process.
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| TUPCH127 |
Fine Grooving of Conductor Surfaces of RF Input Coupler to Suppress Multipactoring
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1310 |
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- T. Abe, T. Kageyama, H. Sakai, Y. Takeuchi
KEK, Ibaraki
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An RF input coupler to feed high power into an accelerating cavity with heavy beam loading undergoes many multipactoring zones due to the wide range of the input RF power. Furthermore, a regular coaxial line is more subject to multipactoring than a rectangular waveguide because of the uniformity of the electromagnetic field. Grooving the conductor surfaces of the coaxial line is a promising method to suppress multipactoring under any conditions expected in the above cases. This paper reports results of our multipactoring simulation study and the high power test of the input coupler with a grooved coaxial line.
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