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MOPB102 |
Comments on Electropolishing at Ettore Zanon SpA at the End of EXFEL Production |
394 |
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- M. Rizzi, G. Corniani
Ettore Zanon S.p.A., Schio, Italy
- A. Matheisen
DESY, Hamburg, Germany
- P. Michelato
INFN/LASA, Segrate (MI), Italy
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In 2013 a new horizontal Electropolishing facility was developed and implemented by Ettore Zanon SpA (EZ) for the treatment of cavities for the European XFEL series production. More than 300 cavities have been treated. Electropolishing has been used for two applications: bulk removal and recovering of cavities with surface defects. Treatment settings have been analysed and compared with cavities performances to verify possible influences of the various parameters. Main parameters considered are treatment time, voltage and current, that together define average thickness removal. We present here the results of these investigation. The facility and process in use are also presented, together with possible next upgrade of the system, facing the new production of cavities for the LCLSII project.
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Poster MOPB102 [1.535 MB]
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THPB035 |
Fabrication of the 3.9 GHz SRF Structures for the European XFEL |
1162 |
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- P. Pierini, M. Bertucci, A. Bosotti, J.F. Chen, P. Michelato, L. Monaco, M. Moretti, R. Paparella, D. Sertore
INFN/LASA, Segrate (MI), Italy
- A. Gresele
Ettore Zanon S.p.A., Nuclear Division, Schio, Italy
- C.G. Maiano, P. Pierini, E. Vogel
DESY, Hamburg, Germany
- C. Pagani
Università degli Studi di Milano & INFN, Segrate, Italy
- M. Rizzi
Ettore Zanon S.p.A., Schio, Italy
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One batch of 10 cavities has been completed and eight structures have been installed in the 3.9 GHz cryomodule for the European XFEL Injector operation. A second batch of 10 RF structures for a spare injector module is under fabrication. The fabrication has been performed according to the European Pressure Vessel regulations, as needed for the EXFEL operation. This paper describes the fabrication, quality control/assurance procedures and frequency preparation steps in order to achieve cavities at the correct frequency and length within the specifications.
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