Paper | Title | Page |
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TUPO024 | Sulfur Residues in Niobium Electropolishing | 421 |
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Funding: Authored by Jefferson Science Associates, LLC under U.S. DOE Contract No. DE-AC05-06OR23177. Electropolishing (EP) in sulfuric/hydrofluoric acid mixtures affords significantly greater surface smoothness than the incumbent buffered chemical polishing (BCP), making it attractive as the future baseline technology for SRF cavity manufacture. However, reported observations of particulate sulfur residues raise concern. One hypothesis is sulfate reduction to elemental sulfur at the cathode, where the measured potential drop is thermodynamically sufficient. Alternatively, the low effectiveness of the cathode’s aluminum oxide surface as a hydrogen recombination catalyst could lead to accumulation of atomic hydrogen, a powerful reductant. We explored these possibilities under standard EP conditions in a small three-electrode laboratory cell. We varied aluminum cathode area to obtain different current densities (and thus overpotentials) at constant cell current. We substituted platinum, an excellent hydrogen recombination catalyst, for aluminum in some experiments. Surface of cathodes were examined with Scanning Electron Microscope (SEM). Surface composition was analyzed by Energy Dispersive X-Ray Spectroscopy (EDS) and X-Ray Photoelectron Spectroscopy (XPS). |
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