Author: Tongu, H.
Paper Title Page
TUPO032 Updates on R&D of Nondestructive Inspection Systems for SRF Cavities 447
 
  • Y. Iwashita, H. Tongu
    Kyoto ICR, Uji, Kyoto, Japan
  • H. Hayano, T. Saeki, K. Watanabe
    KEK, Ibaraki, Japan
 
  We are developing high resolution eddy current scan and High density Tmap and X-map. The high resolution eddy current scan showed 100 μm diameter hole with 50μm depth that was drilled on a Nb plate. The surface mount print circuit technology is applied to the high density Tmap and X-map devices, which will be ready soon to test at a vertical test bench. In addition, radiography using Xrays and neutrons are also under study. The results and status will be presented.  
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