Author: Padamsee, H.
Paper Title Page
TUPO013 Assembly of the International ERL Cryomodule at Daresbury Laboratory 382
 
  • P.A. McIntosh, R. Bate, P. Goudket, J.F. Orrett, S.M. Pattalwar
    STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom
  • S.A. Belomestnykh, M. Liepe, H. Padamsee, P. Quigley, J. Sears, V.D. Shemelin, V. Veshcherevich
    CLASSE, Ithaca, New York, USA
  • A. Büchner, F.G. Gabriel, P. Michel
    HZDR, Dresden, Germany
  • M.A. Cordwell, T.J. Jones, J. Strachan
    STFC/DL, Daresbury, Warrington, Cheshire, United Kingdom
  • J.N. Corlett, D. Li, S.M. Lidia
    LBNL, Berkeley, California, USA
  • T. Kimura, T.I. Smith
    Stanford University, Stanford, California, USA
  • R.E. Laxdal
    TRIUMF, Canada's National Laboratory for Particle and Nuclear Physics, Vancouver, Canada
  • D. Proch, J.K. Sekutowicz
    DESY, Hamburg, Germany
 
  The collaborative development of an optimised cavity/cryomodule solution for application on ERL facilities is nearing completion. This paper outlines the progress of the module assembly and details the processes used for final cavity string integration. The preparation and installation of the high power couplers will be described, as will that of the HOM loads. The testing and integration of the various sub-components of the cryomodule are also detailed in this paper.  
 
THPO001 Quench Simulation Using a Ring-Type Defect Model 687
 
  • Y. Xie, M. Liepe, H. Padamsee
    CLASSE, Ithaca, New York, USA
 
  Funding: Work supported by NSF and Alfred P. Sloan Foundation.
A 2 dimensional ring-type defect thermal feedback model has been improved by including magnetic field enhancement at the pit edge. Latest simulation results show that there is a thermally stable state below the quench field with part of edge becoming normal conducting, which can explain pre-heating phenomenon observed in thermometry measurements. 3D magnetic field enhancement calculations of pit structures using Omega3P shows angular non-uniform field enhancement around the edge. Those findings will be incorporated into a 3D finite ring-type defect thermal codes.